Lab Services

Independent Reliability Testing and Failure Analysis 

Third party lab services with 30 years of proven experience supporting mission critical applications.

Credibility

Built on credibility and trust. As an independent third-party lab, i3 provides objective testing and analysis backed by deep technical expertise as a true center of competence. With a strong focus on supplier qualification, i3 helps ensure components and materials meet strict reliability standards. Through a data-driven approach to risk reduction, customers gain clear, actionable insights that support confident decision-making and long-term product performance.

  • Independent third party lab 
  • Center of competence 
  • Supplier qualification focus 
  • Data driven risk reduction 

Core Testing Capabilities

Accelerated Life & Thermal Testing 

Accelerated Life and Thermal Testing designed to evaluate long-term performance and reliability. With a focus on identifying electrical opens, testing is customized based on real-world operating conditions and risk site analysis. This process enables accurate mean time to failure determinations, helping predict product lifespan under stress. Engineers also pinpoint potential risk sites and analyze component failure rates, providing valuable insights that drive more robust and dependable circuit board and cable assembly designs.

  • Accelerated Thermal Cycling (ATC)
  • Deep Thermal Cycle (DTC)
  • JEDEC Testing/ IPC Specifications
  • High Temperature Storage

Humidity & Bias Testing

Humidity and Bias Testing to evaluate how products perform in harsh environmental conditions. Through methods such as Temperature and Humidity with Bias (THB), High Accelerated Stress Testing (HAST), cyclic temperature and humidity exposure, and autoclave (pressure cooker) testing, i3 simulates real-world moisture and thermal stress. These tests help identify potential failure points, ensuring circuit boards and cable assemblies maintain reliability and performance in demanding environments.

  • Temperature and Humidity w/bias (THB)
  • Cyclic Temperature and Humidity

Electrical Opens & Shorts Analysis

Electrical Opens and Shorts Analysis to ensure the integrity and reliability of circuit boards and cable assemblies. i3 partners with customers to develop testing strategies based on real-world operating conditions and risk site analysis. Using methods such as Surface Insulation Resistance (SIR) testing and Conductive Anodic Filament (CAF) testing, the team identifies potential failure points and electro-migration risks. This approach helps detect opens and shorts early, improving product performance and long-term durability.

  • Partner with our customers to perform testing strategy based on field operating conditions, or risk site analysis
  • Surface Insulation Resistance testing (SIR)
  • Cathode Anodic Filament Testing (CAF)
  • Risk site electro migration concerns

Failure Analysis & Materials Characterization 

Failure Analysis and Materials Characterization to deliver precise insight into product performance and reliability. Equipped with relay and interface boards supporting up to 960 channels per tester, i3 enables high-capacity, detailed analysis. Mobile, chamber-independent systems provide flexible testing setups, while high-precision readouts using HP3458A meters ensure accurate measurements. With automated continuous monitoring and multi-bias (voltage) capabilities, i3 captures critical data needed to identify failure mechanisms and improve material and design performance.

  • Independent of Test Chambers (Mobile)
  • Automated Continuous Monitoring
  • Multi-Bias (Voltage) Measurements

Advanced Monitoring
& Equipment

High Channel Count Automated Monitoring

  • 960 channel capability 
  • Continuous data acquisition 
  • Multi bias voltage measurements 
  • Independent mobile testers 
  • High precision instrumentation 

How We Reduce Risk

i3 Assembly ensures product reliability through a disciplined four-step field-conditioning process designed to reduce risk during lab testing. First, accelerated testing pushes circuit boards and cable assemblies beyond normal operating limits to uncover potential weaknesses early. Next, data monitoring captures real-time performance metrics, allowing engineers to identify trends and anomalies. When issues arise, failure analysis is conducted to determine root causes with precision. Finally, insights from testing are applied through customer design improvement, strengthening future iterations for enhanced durability and performance. This systematic approach helps i3 Assembly deliver high-quality, dependable electronics built to withstand real-world conditions.

Why Choose i3 Lab

Independent Third-Party Validation
Customized Test Strategies
Risk Site Focused Methodology
Integrated Engineering Insight
Rapid Response & Scalable Capacity

Validate Performance
Before Field Deployment

By rigorously testing advanced circuit boards and custom cable and harness assemblies under real-world and accelerated conditions, i3 helps identify risks early and ensure reliable performance. Gain confidence in your products before they reach the field with data-driven insights and proven testing expertise.

Request for a Test Plan Review