Industries We Serve

Industries We Serve 

Military  

Advanced Electronics for Military Innovation

I3 Assembly delivers high-reliability reliable Electronic Solutions for Mission-Critical Applications electronic solutions for mission-critical aerospace, defense, and advanced technology systems where failure is not an option. From prototype through full-scale production, we support complex electronic assemblies used in avionics, combat vehicles, electronic warfare, sensor systems, RF applications, and unmanned platforms. Our advanced System-in-Package (SiP) technology enables significant Size, Weight, and Power (SWaP) reductions while maintaining high performance and signal density. All manufacturing, testing, and kitting are supported at our secure North American facility, ensuring rapid turnaround and dependable quality for the most demanding environments. 

i3 Assembly components and assemblies support a wide range of deployed and emerging defense and aerospace platforms including F-35, Bradley, Stryker, Patriot, JLTV, M1 Abrams, Link-16 radios, satellite communications systems, electronic warfare platforms, and numerous classified sensor and intelligence systems. 

A key subcontractor supporting the U.S. Department of Defense required high-performance semiconductor packaging for a secure advanced computing application. i3 Assembly’s vertically integrated semiconductor packaging and System-in-Package capabilities were selected, enabling us to deliver module assemblies, PCBs, fully tested PCB assemblies, and engineering services while meeting strict security and performance requirements. 

Type your paragraph here

Space Applications 

High-Reliability Electronics for Space Applications  

i3 Assembly provides advanced semiconductor packaging and electronic assembly solutions designed for the extreme reliability requirements of space systems. Supporting programs from prototype through production, we manufacture high-performance multi-chip modules and electronic assemblies used in satellites, space platforms, and mission-critical orbital systems. Our vertically integrated engineering and manufacturing approach enables high I/O density, optimized performance, and scalable production for demanding space environments. 

i3 Assembly technologies have supported electronics used in major space platforms including: 

  • Advanced Extremely High Frequency (AEHF) satellite systems 
  • Europa exploration programs 
  • International Space Station systems 

A leading industrial aerospace client required a partner capable of manufacturing high-performance semiconductor packaging from prototype through full production. i3 Assembly provided a vertically integrated solution, collaborating with the customer to improve performance and manufacturability while delivering high I/O multi-chip module prototypes and supporting scalable volume production. 

Commercial/Industrial  

Advanced Electronics for Commercial & Industrial Innovation

I3 Assembly delivers high-reliability reliable Electronic Solutions for Mission-Critical Applications electronic solutions for mission-critical aerospace, defense, and advanced technology systems where failure is not an option. From prototype through full-scale production, we support complex electronic assemblies used in avionics, combat vehicles, electronic warfare, sensor systems, RF applications, and unmanned platforms. Our advanced System-in-Package (SiP) technology enables significant Size, Weight, and Power (SWaP) reductions while maintaining high performance and signal density. All manufacturing, testing, and kitting are supported at our secure North American facility, ensuring rapid turnaround and dependable quality for the most demanding environments. 

i3 Assembly components and assemblies support a wide range of deployed and emerging defense and aerospace platforms including F-35, Bradley, Stryker, Patriot, JLTV, M1 Abrams, Link-16 radios, satellite communications systems, electronic warfare platforms, and numerous classified sensor and intelligence systems. 

A key subcontractor supporting the U.S. Department of Defense required high-performance semiconductor packaging for a secure advanced computing application. i3 Assembly’s vertically integrated semiconductor packaging and System-in-Package capabilities were selected, enabling us to deliver module assemblies, PCBs, fully tested PCB assemblies, and engineering services while meeting strict security and performance requirements. 

Type your paragraph here

Medical 

High-Reliability Electronics for Medical Technology or Advanced Electronics for Medical Devices 

i3 Assembly provides advanced semiconductor packaging and electronic assembly solutions designed for the extreme reliability requirements of space systems. Supporting programs from prototype through production, we manufacture high-performance multi-chip modules and electronic assemblies used in satellites, space platforms, and mission-critical orbital systems. Our vertically integrated engineering and manufacturing approach enables high I/O density, optimized performance, and scalable production for demanding space environments. 

i3 Assembly technologies have supported electronics used in major space platforms including: 

  • Advanced Extremely High Frequency (AEHF) satellite systems 
  • Europa exploration programs 
  • International Space Station systems 

A leading industrial aerospace client required a partner capable of manufacturing high-performance semiconductor packaging from prototype through full production. i3 Assembly provided a vertically integrated solution, collaborating with the customer to improve performance and manufacturability while delivering high I/O multi-chip module prototypes and supporting scalable volume production. 

 Transportation

High-Reliability Electronics for Transportation or Reliable Manufacturing for Transportation Systems 

i3 Assembly provides advanced semiconductor packaging and electronic assembly solutions designed for the extreme reliability requirements of space systems. Supporting programs from prototype through production, we manufacture high-performance multi-chip modules and electronic assemblies used in satellites, space platforms, and mission-critical orbital systems. Our vertically integrated engineering and manufacturing approach enables high I/O density, optimized performance, and scalable production for demanding space environments. 

i3 Assembly technologies have supported electronics used in major space platforms including: 

  • Advanced Extremely High Frequency (AEHF) satellite systems 
  • Europa exploration programs 
  • International Space Station systems 

A leading industrial aerospace client required a partner capable of manufacturing high-performance semiconductor packaging from prototype through full production. i3 Assembly provided a vertically integrated solution, collaborating with the customer to improve performance and manufacturability while delivering high I/O multi-chip module prototypes and supporting scalable volume production.